- 商品コード：
-
code:pg_0904_09
PDF/月刊誌論文/code:pg_0904_09 マテリアル インテグレーション 2009年4月号
- 通常価格(税込)：
-
2,200
円
- 販売価格(税込)：
-
2,200
円
ポイント：
0
Pt
- 関連カテゴリ：
-
電子出版物(マテリアルインテグレーション論文)
> 2009
PDF/月刊誌論文/code:pg_0904_09 マテリアル インテグレーション 2009年4月号
ELECTRONIC CERAMICS MEMSデバイス関係の半導体プロセスとエレセラ材料技術のせめぎあい
Micromachining of LiNbO3 and its application to wireless passive SAW sensors
■著者
Department of Nanomechanics, Graduate School of Engineering, Tohoku University Sendai Andrew B. Randles
■要約
ne reason that LiNbO3 is generally not used in MEMS devices is the lack of its bulk micromachining technology. The authors have examined the etch rate dependence on the crystal orientation of LiNbO3 and developed a novel etch stop technology for LiNbO3. The etch rate data allows the prediction of etched shapes based on mask designs and wafer orientation. The etch stop technology allows for the fabrication of new devices with diaphragms or cantilevers in LiNbO3, which were previously impractical. We proposed SAW-based wireless pressure sensor based on these technologies.
